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The
evolution of multimedia rich products such as camera phones,
handheld gaming systems, digital cameras, portable media players,
and flat panel displays is driven by an ever-accelerating deployment
of more and more complex applications that offer increased
functionality for each succeeding product generation. These products
also need to continuously become smaller, faster, more reliable and
cheaper. These systems trends are pushing the level of silicon
integration to the point where it has become necessary to blend
multiple functions in one package as either: a system-on-chip (SoC),
where the necessary components are integrated onto a single silicon
die; or system-in-package (SiP), where different chips are assembled
together in a single package.
One of the inherent advantages of
SiP over SoC, however, is that different types and generations of
chips can be combined in a single package, giving systems designers
a higher degree of product design flexibility. SiP is not limited by
the constraints of a common wafer process, so that each IC chip used
in a SiP can be optimally designed and manufactured for its
function. This approach ensures maximum quality and flexibility in
selecting the proper components, each manufactured using the optimum
process, thereby maximizing quality, design while minimizing cost,
test time, and time to market.
Many
applications today harness the power of faster processors and
interfaces, which creates products with more features and better
performance. More features and better performance means a demand for
increased dynamic random access memory (DRAM), the densest form of
fast memory on the market. Because of its greater density and
smaller cell size, this memory is less expensive per memory bit to
manufacture, and more suitable for high-end applications like
processing, graphics, multimedia, etc. With all the advantages of
DRAM, it cannot be economically integrated onto a SoC as embedded
memory, and until now has been extremely difficult to stack into a
SiP in a high volume, reliable production setting.
Inapac’s
SiPFLOW™
platform provides a cost-effective and reliable methodology for SiP
optimized solutions in multimedia rich devices. Along with its I.P.
and services business model, Inapac offers its customers a
comprehensive array of SiP related expertise to achieve rapid time
to market advantages.
Inapac is now successfully deploying
its technology into the following markets:
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Multimedia cell phones
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Smart
phones/PDAs
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Micro-drive storage
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Digital
cameras
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LCD
displays/advanced TVs
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