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| Test & Assembly Partners |
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| Inapac’s IP and services engagement model provides
comprehensive engineering
support
for SiP package design, assembly and testing.
Inapac has extensive experience in enabling high volume SiP
production at leading assembly and test service providers. The
following is a partial list of providers where Inapac’s test
methodology has been deployed.
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| Amkor
Technology, Inc.
Amkor Technology,
Inc. (Nasdaq:
AMKR
) offers the industry's broadest array of package
formats and sizes, from traditional, "off-the-shelf"
leadframe configurations to leading-edge chip scale, flip chip and
system-in-package solutions incorporating highly customized designs.
This allows Amkor to be a single source for many of their customers'
total IC packaging requirements.
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| ASE
Group
The
ASE
Group is the world's largest provider of
independent semiconductor manufacturing services in assembly and
test. As a global leader geared towards meeting the industry's ever
growing needs for faster, smaller, and higher performance chips, the
company provides a complete solution of semiconductor backend
manufacturing services to their customers, including front-end
engineering testing, wafer probing, final testing of logic, mixed
signal, and memory semiconductors, and her test-related services.
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KYEC
King Yuan
Electronics was founded in 1987 and has grown to become a
world leader in developing and delivering test solutions. KYEC has 4
state-of- the- art facilities to provide immediate support to their
customers, KYEC has regional offices throughout the world, covering
USA, Japan, Europe and Singapore. Service currently available
are: Test Development Engineering, Wafer Probe, Pre-assembly, and
Final Test, covering a full range of applications such as RF,
Mixed-signal, Digital, Memory, LCD driver, CIS/CCD and SOC.
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| Siliconware
Precision Industries Co., Ltd. (SPIL)
Siliconware is a
leading supplier of Assembly, Test, and Bumping services. They
also provide a
Design
Center
and
Package
Characterization
Center
for their many customers. Reliability
systems are incorporated into their manufacturing process control
and continuous quality improvement programs. Precise Failure
Analysis is a vital too built into SPIL's qualification, yield
management, and manufacturing processes.
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United
Test and Assembly Center Ltd
(UTAC)
Established in
1997 and listed on the Main Board of the Singapore Exchange on 9
February 2004 (“UTAC – SGX:UnitedTAC”), United Test and
Assembly Center Ltd ("UTAC") is a leading independent
provider of test and assembly services for a wide range of
semiconductor devices that include memory, mixed-signal/RF and logic
integrated circuits. UTAC was ranked 2006's 5th largest independent
provider of semiconductor assembly and test services by
Gartner
Dataquest
in February 2007.
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Walton
Advanced Enginering, Inc.
Founded in 1995,
Walton Advanced Engineering Inc. is a memory assembly and testing
service provider located in Kaohsiung Export Processing Zone (K.E.P.Z),
Taiwan. Walton provides end to end turnkey services include IC
packaging, final test, finished goods burn-in, and drop shipment to
end customers. With
a focus on service, innovative technology, and continuous
improvement, Walton is committed to achieving total customer
satisfaction.
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