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Inapac Teams With e-MDT for Sales and Application Support
in
Korea
Focus
to be providing SiP/MCP solutions for cellular handset, WiMAX and
digital display applications
San Jose, CA – Nov. 5, 2007
– Inapac Technology, Inc., a leading provider of DRAM solutions
optimized for system-in-package (SiP) and multi-chip-package (MCP)
devices, today announced an agreement with e-MDT, Inc.,
a Seoul-based ASIC design and development company, to serve as Inapac’s representative for the Korean
market. Under
the agreement, e-MDT adds DRAM based on Inapac’s proven SiPFLOW™
design-for-test (DFT) intellectual property (IP) to its product
portfolio, and will serve as a design center partner for Inapac
customers in the Korean market.
With SiPFLOW platform-based memory, e-MDT now offers a proven
production and test methodology for integrating cost-effective,
known-good-die (KGD) DRAM with logic die to produce reliable SiP/MCP
devices for high-volume applications.
Inapac’s approach enables the lowest cost of ownership for
stacked DRAM in high-volume SiP/MCP implementations,
while achieving industry-leading reliability rates of less than 100 dppm (defective
parts per million).
eMDT, which has achieved notable success with the leading Korean
cell phone companies, will combine its extensive ASIC and SoC design
services and its back-end testing and verification expertise with
SiPFLOW-based KGD to deliver SiP/MCP solutions optimized for cellular
handset and digital display applications.
“We are extremely pleased to add Inapac‘s products to our
portfoliio,” said Jay Jeong, president and CEO of e-MDT.
“This agreement enables us to deliver cost and reliability
advantages over traditional KGD approaches, allowing the industry’s
leading electronics companies to quickly and cost-effectively
implement SiPs/MCPs for their high-volume applications.”
“We're very excited about establishing a relationship with
e-MDT,” said Naresh Baliga, vice-president of marketing at Inapac.
“This represents a major expansion of our ability to serve
the Korean market, which is a strong and growing consumer of SiPs and
MCPs for cell phones and other portable devices.
With its
established history and reputation in providing ASIC, SoC and SiP/MCP
solutions, e-MDT is an ideal partner to help expand use of Inapac DRAM
designs and the SiPFLOW methodology.”
The
SiPFLOW Platform
The
Inapac SiPFLOW platform balances low-cost production and high
reliability for DRAM die, making it easier and less expensive to
integrate memory into single-package devices.
It combines SiP/MCP-optimized memory IP with a complete,
integrated test infrastructure
that provides significant cost efficiencies at both the wafer sort and
final test steps.
After assembly, the memory portion of the SiP/MCP can be fully
exercised and tested using the Inapac SiPLINK™
test connections and conventional
high-volume memory test equipment.
In addition, the SiPFLOW methodology allows for continuous
improvement over the SiP/MCP product lifecycle.
With it, test results can be accumulated and analyzed to
fine-tune the manufacturing process and to further correlate wafer
sort and final test results to achieve increased yield and
reliability.
About e-MDT
e-MDT
is a specialized fabless and chipless ASIC company that provides full turn-key, extended SoC
design services, including
integrated circuit design, intellectual property design, fabrication,
and supply chain management. It has fully staffed ASIC design centers in both the
United
States
and
Korea
,
specializing in the design of sub-micron ASIC and ASSP integrated
circuits, along with intellectual property necessary to design new
innovative products for emerging markets.
e-MDT provides the traditional back-end design services, and
also provides full turn-key, front-end design services. The company
couples innovative ASIC designs with manufacturing services provided
by its foundry partners to deliver the most cost-effective ASIC design
solutions in the shortest period of time.
For more information, visit the company’s Web site at www.e-mdt.com.
About
Inapac
Inapac
Technology, Inc., is a leading provider of memory technology and
services for system-in-package (SiP) and multi-chip-package (MCP)
solutions. Inapac provides
IP and services based on a design-for-test (DFT) production
methodology to deliver reliable, cost-effective memories.
Products based on the company’s proven SiPFLOW™ platform
are licensed to semiconductor companies to enhance the performance,
quality and reliability of products in the cell phone, consumer
audio/video, digital imaging, and storage markets.
Inapac is headquartered in
San Jose
,
California
, with additional
offices in
Boise
,
Idaho
, and
Hsin-chu
,
Taiwan
.
For more information, visit the company’s website at www.inapac.com.
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