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Inapac
Technology Products Selected by Vimicro for
Mobile
Multimedia Processors
Leading
Chinese Supplier Chooses Inapac-Enabled 16- and 32-Megabit
DRAM
for
System-in-Package Solutions
San Jose
CA
--
March 5, 2007
-- Inapac Technology, Inc., today announced
that Vimicro Corporation (NASDAQ: VIMC), a leading fabless
semiconductor company in
China
, will begin using memory die based on Inapac's
SiPFLOW™ DFT (design-for-test) methodology to deliver low-cost,
reliable SiP (system-in-package) solutions. The low-power
DRAM
devices, which are optimized for SiP and MCP
(multi-chip-package) applications, will be incorporated into
Vimicro’s recently announced Vinno family of multimedia processors,
which target the mobile phone handset market and offer one of the
industry's highest levels of multimedia-function integration.
Inapac's
16Mb (megabit) and 32Mb SiPFLOW
DRAM
products have already achieved high-volume
production status, and are addressing memory needs in mobile phones
and a variety of other consumer applications. Inapac's unique SiPFLOW
platform methodology has demonstrated reduced overall cost of
ownership, while ensuring high yield and reliability of SiPs.
"The
demand for multimedia capabilities is exploding in mobile
communications, and Vimicro seeks to maintain a product portfolio that
provides the necessary range of multimedia processors, based on our
expertise in system, firmware, embedded software and multimedia SoC
design," said
Kevin
Jin
, president and
COO
at Vimicro. "The addition of
DRAM
based on Inapac's DFT platform and methodology
will give us the opportunity to continue expanding the capabilities of
our processors, while also controlling cost and achieving the
reliability that our customers require."
"We're
very excited to have the leading Chinese multimedia processor company
select SiPFLOW-enabled
DRAM
for its Vinno product line," said
Naresh
Baliga
, vice president of marketing at Inapac. "This
represents a significant step for Inapac, allowing us to help meet the
needs of one of the world's fastest growing mobile phone
markets."
The SiPFLOW Platform
The
Inapac
SiPFLOW
platform addresses the challenges of ensuring the
quality of KGD (known-good die) memory components and achieving
consistent, reliable system assembly. To
support
these goals, it integrates a unique and
proprietary test bus that allows both full wafer test without burn-in
and testing of the finished SiP/MCP.
Wafer-level test uses Inapac's VIBE™ (Voltage-Induced Burn-in
Emulation) voltage-based methodology, which is equivalent to
traditional oven-based burn-in testing but eliminates the specialized
capital and test cost burden of using elevated temperatures.
After assembly, the memory portion of the SiP/MCP can be fully
exercised and tested using the Inapac SiPLINK™ test technology.
This, for the first time in the industry, enables the SiP/MCP
integrator to screen out quality-related issues that may have been
introduced as a result of the assembly process. All testing is done
with industry-standard test equipment. In addition, test results can
be accumulated by Inapac and used to fine-tune the manufacturing
process to further increase yields and reliability.
About
Vimicro
Vimicro International Corporation (Vimicro) is a fabless
semiconductor company that designs, develops and markets semiconductor
products and solutions that enable multimedia capabilities in a
variety of products for the consumer electronics and communications
markets. The Company primarily designs, develops and markets
multimedia processors for personal computers (PCs) and mobile phones.
The Vinno processors are a family of high-performance mobile
multimedia application processors with the highest level of
integration of the new multimedia functions, such as MPEG4 and H.264
video, MP3,
AAC
/aacPlus and WMA audio, video conferencing and
graphics for gaming, as well as other popular features, such as
multi-mega-pixel cameras, polyphonic ringtone, 3D stereo sound, and
many analog and mixed-signal circuits. For more
info
rmation, visit the company's Web site at http://www.vimicro.com.
About Inapac
Inapac Technology, Inc. is a leading provider of memory
technology and services for SiP (system-in-package) and MCP
(multi-chip-package) solutions. Inapac provides IP and services based
on a DFT (design-for-test) production methodology to deliver reliable,
cost-effective memories. Products based on the company's proven
SiPFLOW™ platform are licensed to semiconductor companies to enhance
the performance, quality and reliability of products in the cell
phone, consumer audio/video, digital imaging, and storage markets.
Inapac
is headquartered in San Jose, California, with additional offices in
Boise, Idaho, and
Hsin-chu
,
Taiwan
. For more
info
rmation,
visit the company's website at www.inapac.com.
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