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Inapac Technology and eSilicon Partner on SiP Program
eSilicon to offer Inapac SIPFLOW memory IP and methodology to enable SiP
applications
Sunnyvale, CA - June 1, 2006 - Inapac Technology, Inc., and eSilicon
Corporation today announced that eSilicon has added Inapac’s proven SiPFLOW™
design-for-test (DFT) intellectual property (IP) to its technology portfolio. With the
SiPFLOW platform, eSilicon’s custom integrated circuit (IC) customers can quickly
and cost-effectively implement system-in-package (SiP) devices for use in
high-volume applications which require the reduced form factor of a single-package
implementation.
The Inapac SiPFLOW platform makes it easier and less expensive to integrate
memory into SiP and multi-chip package (MCP) devices, combining
SiP/MCP-optimized memory IP with a complete, integrated test infrastructure. The
methodology eliminates much of the extra cost involved in producing known good die
(KGD), and results in unsurpassed final-product reliability levels. Inapac has proven its
DFT IP with a low-power, 16M-bit SDRAM design that has been used in more than 10
million shipped units.
“Adding Inapac’s industry-proven SiPFLOW platform to eSilicon’s broad IP portfolio
will provide our customers with significant benefits,” said Hugh Durdan, Vice
President of Marketing, eSilicon. “The combination of eSilicon’s custom chip
expertise and our SiPFLOW platform-enhanced IP portfolio will enable the industry’s
leading electronics companies to quickly and cost-effectively implement small
form-factor ICs for their high-volume applications.”
The Inapac SiPFLOW platform addresses the challenges of ensuring the quality of
KGD memory components and achieving consistent, reliable system assembly. To
support these goals, it integrates a unique and proprietary test bus that allows for full
test without burn-in, as well as testing of the finished SiP/MCP.
"We’re pleased to partner with eSilicon to address memory requirements for
high-volume consumer applications,” said Richard Egan, CEO of Inapac. “Inapac’s IP
and methodology enable media-rich capabilities in consumer devices at highly
attractive price points.”
Availability
The SiPFLOW platform is available now through eSilicon. For more information please
contact a local sales office or visit http://www.esilicon.com
About eSilicon Corporation
eSilicon designs and manufactures custom integrated circuits for the world’s leading
electronics companies. The company serves both system OEMs and fabless
semiconductor companies who apply custom silicon to create innovative new
products. eSilicon designs and ships custom chips for a wide variety of markets and
applications, including high-volume MP3 players, home gateways, complex storage
networks, and high-speed communications devices.
Established in 2000 and lead by a team of industry veterans, eSilicon is a pioneer and
award-winning market leader, widely recognized for innovation and operational
excellence. The company combines in-house design and manufacturing expertise to
provide customers with a low-risk, low-cost path to the best technology available in
the semiconductor industry. eSilicon is headquartered in Sunnyvale, CA, with offices
in Allentown, PA, New Providence (Murray Hill), NJ, Shin Yokohama, Japan, and
Bucharest, Romania. For more information, please visit http://www.esilicon.com.
About Inapac
Inapac Technology, Inc., is a leading provider of technology and services for
system-in-package (SiP) and multi-chip package (MCP) applications. It is focused on
providing IP to enable the production of reliable, cost-effective memories optimized
for SiP/MCP. Products based on the company’s patented SiPFLOW platform are
licensed to semiconductor and systems companies to enhance the performance,
quality and reliability of products in the cell phone, consumer audio/video, digital
imaging, and storage markets. Inapac is headquartered in San Jose, California with
additional offices in Boise, Idaho and Hsinchu, Taiwan. For more information, visit the
company’s website at http://www.inapac.com.
eSilicon and the eSilicon logo are trademarks of eSilicon Corporation. All other are
property of their respective owners.
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