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Intellectual Property & Services For Reliable SiPs |
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| Press Release |
Inapac Technology Enables High Volume Production of System in Package (SiP) Optimized SDRAM ApplicationsOver One Million Per month 16Mbit SiP Units Enabled with Inapac’s unique SiPFLOWTM Platform San Jose, CA, -- March 11, 2005 – Inapac Technology, Inc., the leading provider of intellectual property (I.P.) and services for reliable system-in-package (SiP) applications, today announced a high volume production milestone for its proprietary SiPFLOW platform. Using this platform, Inapac has achieved a significant production milestone for its lead I.P. product, the 16Mbit SDRAM design. The SiP-optimized, stackable, high-performance, low-power design has been successfully proven in high volume production for mobile multimedia applications, achieving shipment rates of over one million units per month. Inapac’s SiPFLOW platform delivers a proven test methodology to achieve best quality and reliability goals in a cost-effective manner. The SiPFLOW platform advantage begins with design of a memory product family with features specifically optimized for SiP integration – small footprint, low-power consumption, high bandwidth operation via a wide bus interface and, most notably, Inapac’s SiPLINKTM testing architecture. SiPFLOW tests memory not only in die form, but also within the final SiP device. “Our customers are demanding higher levels of quality and reliability in SiPs than what KGD is able to deliver,” said Naresh Baliga, Inapac’s vice president of marketing. “Inapac’s SiPFLOW platform delivers industry leading reliability metrics of 200 dppm or less in high volume production settings.” The Inapac 166MHz IT16M32SD and the 100MHz IT16M32SDL I.P. products are high-speed and low-power (1.8V CMOS), dynamic random-access memory designs. Both designs incorporate Inapac's proprietary Design-For-Test (DFT) technology using Voltage Induced Burn-in Emulation (VIBE™) technology. With the VIBE technology, Inapac delivers an equivalent level of quality and reliability to temperature level burn-in testing, without requiring the capital-intensive operational infrastructure. Inapac’s SiPFLOW platform provides a cost-effective and reliable methodology for SiP optimized solutions in multimedia mobile phones, consumer audio/video portables, digital displays and micro-hard drive storage devices. Along with its I.P. and services business model, Inapac offers its customers a comprehensive array of SiP related expertise to achieve rapid time to market advantages. About Inapac Inapac Technology, Inc., is the leading provider of technology and services for system-in-package (SiP) applications. The company is exclusively focused on developing IP to enable the production of reliable, cost-effective DRAMs, optimized for SiP. Based on Inapac's patented SiPFLOWTM platform, these products are used by some of the largest semiconductor and systems companies in the world to enhance the performance, quality and reliability of their offerings in the cell phone, consumer audio/video, digital imaging, and storage markets. Inapac is headquartered in San Jose, California with additional offices in Boise, Idaho and Hsinchu, Taiwan. For more information, visit the company’s website at www.inapac.com. Media Contact US Media Contact Taiwan Media Contact
Carol Su |
| © 2005. Inapac Technology, Inc. |
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