Intellectual Property & Services For Reliable SiPs

System-In-Package Leader Appoints Richard Egan New President and CEO

 Industry Veteran Chosen To Guide Growing Innovative Memory Product Company

San Jose, CA -- Nov. 8, 2004 - Inapac Technology, Inc., the leading semiconductor company exclusively focused on DRAM for system-in-package (SiP) applications, today announced that Richard Egan has joined the company as President and CEO. Egan will be responsible for guiding Inapac as it rapidly scales-up production to meet the growing demands for its proprietary high-performance DRAM die for stackable and multichip applications.

Egan brings to Inapac over 20 years of experience in high-technology senior management, marketing and sales at both large and small firms. Prior to joining Inapac, he served as CEO of Aeluros, a start- up focused on high-speed, mixed signal PHY's for the communications market. Previously, Egan was General Manager of Conexant's Silicon Valley Design Center, formed after Conexant acquired HotRail Inc. At HotRail, a venture-backed startup developing multi-gigabit transceivers and switch fabrics, Egan led the Sales and Marketing efforts. Earlier, he spent 10 years at LSI Logic in a variety of senior roles, including managing LSI's entry into the SAN space through targeted investments in the nascent Fibre Channel market. Egan also held management positions at Headland Technology, Video Seven and Nixdorf Computer.

Founded in 2000 by an expert team of DRAM specialists, Inapac has developed a family of unique memory die products. Based on Inapac's proprietary wafer stress methodology called voltage induced burn-in emulation (VIBE™) technology, these die components are used by some of the largest semiconductor and systems companies in the world to enhance the quality and performance of products such as cell phones, hard disk drives, and digital imaging devices.

"Inapac's DRAM enabled system-in-package technology allow semiconductor and system companies unprecedented features in small form factor designs," said Richard Egan, Inapac's new President and CEO. "Our reliable methodology for testing and yielding DRAM die for SiP is the foundation for next generation high function consumer products and Inapac is uniquely positioned to drive this fundamental shift in SiP architecture."

"Richard is a perfect match for Inapac because he understands our vision, and shares our enthusiasm in solving a significant industry problem," stated Fan Ho, Inapac's Co-founder and VP of Operations. "We are confident that Richard's knowledge and expertise will play a key role in Inapac's industry-leading research, development and continued company growth."

About Inapac
Inapac Technology, Inc. is the leading semiconductor company exclusively focused on DRAM for system-in-package (SiP) applications. Founded in 2000 by an expert team of DRAM specialists, Inapac has developed a family of unique die products architected and optimized for its target markets. Based on Inapac's patented VIBE™ technology, these die components are used by some of the largest semiconductor and systems companies in the world to enhance the performance and quality of some of their leading products, in particular in the cell phone, hard disk drive, and digital imaging markets. Inapac is headquartered in San Jose, California with additional offices in Boise, Idaho and Hsinchu, Taiwan. For more information, visit the company's website at www.inapac.com.

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John C. Tran
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