Intellectual Property & Services For Reliable SiPs

Inapac Technology Opens Hsinchu Offices

DRAM for System-in-Package Leader Strengthens Commitment To East Asian Customers

Hsinchu, TAIWAN -- August 10, 2004 - Inapac Technology, Inc., the leading semiconductor company exclusively focused on DRAM for system-in-package (SiP) applications, today announced the newest addition to its global locations with a new office in Hsinchu, Taiwan. The new branch office further extends the company's ability to quickly service customers in East Asia and was selected for its close proximity to Taiwan's leading semiconductor manufacturers.

The new facility demonstrates Inapac's commitment to key customers in the region, particularly those with operations in Taiwan. Using its proprietary wafer stress methodology called voltage induced burn-in emulation (VIBE™), Inapac can provide high-performance DRAM dies for stackable and multichip applications. VIBE eliminates the requirement for industry standard, oven-based, burn-in stress testing, ensuring high quality and reliability at the die level, which enables the effective integration of complex DRAM into SiP. Inapac's stackable DRAM technology overcomes the primary barrier for space-efficient, economical SiP solutions in many of today's portable, high bandwidth, and media processing-intensive applications. This innovative new technology has been proven in design wins and through volume shipments to some of the largest semiconductor companies in the world.

"The decision to open a new branch office in Hsinchu comes as a direct result of our increased engagement with top foundries and customers in East Asia," said Allen Yen, General Manager of Inapac Hsinchu. "We believe that Inapac's proven expertise, including its ability to provide local support and localized solutions, will allow us to roll out our unique DRAM die products in a very short period of time and begin offering our partners and customers the compelling range of applications and service they demand."

To deliver ongoing size reductions while continuing to increase performance and functionality, manufacturers of mobile phones, flat panel displays, hard disk drives, and other electronic products are increasingly considering cost effective and advanced packaging technologies such as SiP, where multiple ICs and other components are integrated into a single package. In memory-intensive applications, integrating DRAM together with other ICs in SiP can significantly reduce footprint, improve signal integrity, reduce power consumption, increase bandwidth, lower cost, and improve reliability. However, conventional commodity DRAM often cannot be used for SiP integration, since it requires a post assembly burn-in process of 12-24 hours to reach a suitable quality level. By contrast, Inapac's DRAM dies designed specifically for SiP utilize embedded logic circuitry to ensure testing and quality at the die level without costly burn-in through the use of Inapac's VIBE methodology.

"We expect our revolutionary VIBE technology to be rapidly embraced by the industry, because it easily allows our customers to significantly improve the power, performance, and size ratio for their high speed and low power devices," said Fan Ho, Co-founder and VP of Operations at Inapac. "Opening our new office in Hsinchu will allow us to maintain close contact with our regional partners and customers, providing them with the industry's most cost-effective DRAM for SiP solutions."

Inapac's technology has been proven in SiP applications with major semiconductor manufacturers. The company offers stackable, SiP-optimized DRAM in sizes ranging from 16Mb to 128Mb, in bus widths from 16bits to 128bits, and is available with JEDEC or custom interfaces in high-speed or ultra low-power versions.

About Inapac
Inapac Technology, Inc. is the leading semiconductor company exclusively focused on DRAM for system-in-package (SiP) applications. Founded in 2000 by an expert team of DRAM specialists, Inapac has developed a family of unique die products architected and optimized for its target markets. Based on Inapac's patented VIBE™ technology, these die components are used by some of the largest semiconductor and systems companies in the world to enhance the performance and quality of some of their leading products, in particular in the cell phone, hard disk drive, and digital imaging markets. Inapac is headquartered in San Jose, California with additional offices in Boise, Idaho and Hsinchu, Taiwan. For more information, visit the company's website at www.inapac.com.

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John C. Tran
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