Intellectual Property & Services For Reliable SiPs

In the News

05/24/2007	Electronic Design Article
04/26/2007	Inapac rolls IP for SiP/MCP designs - EE Times
06/01/2006	eSilicon adds Inapac's SiP line to portfolio - EE Times
08/09/2004	SiPs pose considerations for die design - EE Times
08/2004	On the Frontiers of Testing - Semiconductor Manufacturing
07/07/2004	Interview with Brian Fernandez (audio) - Wall Street Reporter
07/2004	Inapac Obtains Third Round of Financing - InsideChips.Ventures
07/2004	Radar Scope: Inapac - Semiconductor Times
06/25/2004	JEAN-PIERRE BRAUN - INAPAC TECHNOLOGY - The Wall Street Transcript
06/21/2004	Inapac Looks To Asia With $15M Series C In Hand - VentureWire
06/09/2004	DRAM Company Inapac Raises $15M In Series C Round - Dow Jones
06/06/2004	Inapac adds $15M in funding - Silicon Valley/San Jose Business Journal
06/2004	Stackable DRAM Dies - Advanced Packaging
05/11/2004	San Jose Startup Says it Feels VIBE - Electronic News
05/10/2004	Custom dice tossed for system-in-package - EE Times

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