Intellectual Property & Services For Reliable SiPs

Press Releases

11/5/2007	Inapac Teams with e-MDT for Sales and Application Support in Korea
10/16/2007	Inapac Announces New 32Mb Stacked DRAM Design
05/30/2007	Inapac Technology and ProMos to Collaborate on 256Mb Mobile DDR DRAM for System-in-Package/Multi-chip Package Applicatiions
04/25/2007	Inapac Technology Releases New 16Mb DRAM Design for Mobile Applications that Reduces SiP/MCP Cost
03/05/2007	Inapac Technology Products Selected by Vimicro for Mobile Multimedia Processors
06/01/2006	Inapac Technology and eSilicon Partner on SiP Program
02/09/2006	Inapac SiPFLOW™ DFT IP Named Finalist for 16th Annual EDN Magazine Innovation of the Year Award
11/10/2005	Inapac Technology Releases New DRAM IP Designs Optimized For System-in-Package (SiP) Applications
03/15/2005	Inapac Technology Enables High Volume Production of SiP Optimized SDRAM Applications
11/08/2004	System-In-Package Leader Appoints Richard Egan New President and CEO
08/10/2004	Inapac Technology Opens Hsinchu Offices
06/08/2004	Inapac Secures $15 Million in Third Round of Financing
05/10/2004	Inapac Technology Unveils Breakthrough Solution for Integrating DRAM in System-in-Package, Multichip Applications

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